الثلاثاء، 26 يوليو 2016

NEWS TECHNOLOGIE

a-silicon-wafer-in-sand-maybe
A new semiconductor report projects that 2D planar scaling will end by 2021, replaced by 3D logic integration and stacked chips -- but how will this affect long-term device scaling and overall performance?

from ExtremeTechExtremeTech http://ift.tt/2adAyB4

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